LED chip capacity surged, flip-chip LED chip dominated

In recent years, China, the United States, the European Union and other countries and regions around the world have successively implemented the ban policy. The market for LED energy-saving bulbs has been further promoted, and the prices of LED lighting products have continued to decline. These have directly led to the rapid increase in the penetration rate of LED lighting. In the three to five years from 2014, the LED lighting industry will usher in explosive growth and enter the gold for three years. The manufacturing technology of the upstream LED chip as the leading link and the corresponding packaging technology jointly determine the future development speed of LED in the field of lighting.
Flip-chip LED chips should emerge as the upstream chip production capacity continues to expand, the packaging industry has entered the era of meager profit, many companies in order to grab customers big price cards, fierce price competition and disorderly industry ecological chain prompted the industry to start demand New packaging process.
The innovation and application of flip-chip LED chip technology with the advantages of improving luminous efficiency and improving heat dissipation capability is the focus of today's packaging companies.
Flip-chip has better heat dissipation than preloaded chips. At the same time, we have epitaxial design, chip process and chip graphic design that are compatible with flip-chip bonding. The chip products have the advantages of low voltage, high brightness, high reliability, high saturation current density, etc., and the integration of protection circuits on the flip-chip substrate can significantly improve the reliability and performance of the chip; Compared with the vertical structure, the flip-chip bonding method makes it easier to realize ultra-high-power chip-level modules and multi-function integrated chip light source technology, which has great advantages in LED chip module yield and performance. In terms of light efficiency, the flip-chip structure avoids light absorption and electrode shading of the conductive layer on the P electrode, and can also improve the light efficiency by providing a reflective layer on p-GaN.
In the long run, flip-chip will reduce the process of packaging and produce a certain squeeze on the packaging industry. In addition, flipping the chip may result in an increase in the driving power of the chip, which in turn reduces the actual consumption of the chip by the lighting backlight application, and changes the long-term demand for the chip for the lighting application.

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