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Recently, Lin Yujie, general manager of Born WorldCom Optoelectronics Co., Ltd. shared the application advantages of flip chip and the future development trend of packaging. He introduced that the flip chip has a 10x point electrode size, metal surface soldering, stronger soldering force, lower thermal resistance, and rated operating voltage close to the theoretical value of 2.8 volts. At the same time, the sapphire surface emits light, and the external quantum efficiency is higher, allowing Fluorescent powder coating, no need for gold wire, no bracket, allowing more than 2 times current injection. The chip-on-chip has obvious advantages in lighting applications, with higher cost performance (lumen/yuan), higher reliability, greater illumination angle, higher luminous density, lower system cost, shorter manufacturing process and convenient scale. Production; and flip-chip cob modules will be mainly used in high-power products, with higher reliability, thermal resistance and temperature-saving than the positive-loading chip 30. It is worth mentioning that the production line of flip chip cob can be reduced by 50. Because there is no gold wire, no bracket, the cost of bom is reduced by 20 or more, and the number of personnel can be reduced by 30, which greatly increases the price/performance ratio. Regarding the future development trend of packaging, he said that the flip chip cob light source will become the main light source configuration of bulbs, downlights, spotlights, mining lamps, etc.; lamp strips, fluorescent tubes, flat panel light sources are still the world of smd Smd is developing in smaller size; csp package enters backlight and flash application on a large scale; chip packaging cost is further reduced, high voltage and small current simplify heat sink, and linear ic simplifies power supply; future light source will focus on light quality and optimize spectral direction development .
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